Assembly and packaging
Development
- Mechanical and thermal design of fixtures and housings
- Layout of PCBs and hybrids
- Selection and test of adhesives, globetop and solder materials
- Selection of methods for positioning and attaching of
semiconductor chips
Prototyping and production
- Surface-Mount-Technology (SMT)
- Hybrids
- Chip on Board
Design Concepts
- Feasibility studies
- Selection of proper technologies
